Tomoko Doi

Title: Tomoko Doi: Innovator in Polymer and Adhesive Technologies

Introduction

Tomoko Doi is a prominent inventor based in Osaka, Japan. She has made significant contributions to the fields of polymer and adhesive technologies. With a total of 4 patents to her name, her work has had a substantial impact on various industrial applications.

Latest Patents

Among her latest patents is a method of thermal adherend release and an apparatus for thermal adherend release. This innovative method allows for the selective release of adherends from a heat-peelable pressure-sensitive adhesive sheet. The process involves initially heating the sticking site of the adherend at a temperature that does not cause the heat-expandable layer to expand, followed by heating at a temperature that does cause expansion, thereby facilitating the release. Another notable patent is a process for producing a polymer that addresses issues such as coloration and mechanical property degradation in molded articles. This process utilizes living radical polymerization to minimize impurities, ensuring high-quality polymer production.

Career Highlights

Tomoko Doi has worked with notable companies, including Nitto Denko Corporation and The General Hospital Corporation. Her experience in these organizations has allowed her to refine her expertise in polymer and adhesive technologies.

Collaborations

Some of her coworkers include Michiharu Yamamoto and Yutaka Moroishi. Their collaboration has contributed to the advancement of innovative solutions in their respective fields.

Conclusion

Tomoko Doi's contributions to polymer and adhesive technologies exemplify her innovative spirit and dedication to advancing these fields. Her patents reflect her commitment to solving complex challenges in industrial applications.