Yokohama, Japan

Tohru Ohsaka


Average Co-Inventor Count = 1.4

ph-index = 7

Forward Citations = 162(Granted Patents)


Location History:

  • Kanagawa, JP (2004 - 2007)
  • Yokohama, JP (1993 - 2015)

Company Filing History:


Years Active: 1993-2015

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13 patents (USPTO):Explore Patents

Title: Tohru Ohsaka: Innovations in Semiconductor Packages and Printed Circuit Boards

Introduction

Tohru Ohsaka, an esteemed inventor residing in Yokohama, Japan, has made significant contributions to the fields of printed circuit boards and semiconductor packaging. With a remarkable tally of 13 patents, his inventive spirit has influenced advancements in electronic technologies that enhance the performance and efficiency of modern devices.

Latest Patents

Ohsaka's most recent patents delve into advanced designs and methodologies for printed circuit and wiring boards. One of his notable patents outlines a printed wiring board structure where main power supply patterns are arranged in a dedicated second region. This innovation allows for the efficient distribution of different DC voltages while minimizing potential fluctuations and suppressing radiation noise. The unique arrangement facilitates a reduction in the number of layers used in the printed wiring board, thus offering a more streamlined and effective solution.

Another significant innovation by Ohsaka is related to the design of stacked semiconductor packages. His patent addresses the complexities of power supply paths that can lead to fluctuating inductance and power bounce, which negatively affects signal quality. By introducing a first solder ball group for connection to the printed wiring board on the second layer of the first semiconductor package, and carefully arranging solder connections on the second semiconductor package, Ohsaka ensures more direct power supply while maintaining high-speed signal integrity.

Career Highlights

Tohru Ohsaka has built an illustrious career as an inventor at Canon Kabushiki Kaisha, a prominent company known for its pioneering contributions to technology. His work has not only earned him numerous patents but also recognition as a leading figure in innovation within the electronics sector.

Collaborations

Throughout his career, Ohsaka has collaborated with various talented individuals, including coworkers Shigenobu Nojo and Hideho Inagawa. Their joint efforts reflect a multidisciplinary approach to solving complex engineering challenges and advancing technological frontiers.

Conclusion

In conclusion, Tohru Ohsaka's inventive prowess manifests in his portfolio of patents revolving around printed circuit boards and stacked semiconductor packages. His contributions facilitate enhancements in electronic devices, addressing critical challenges while promoting efficiency and performance. Ohsaka's work exemplifies the essence of innovation, making him a notable figure in the realm of technology and design.

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