Company Filing History:
2 out of 20,290 
1 out of 832,843 Years Active: 1999-2003
Title: Innovator Spotlight: Todd W. Buley
Introduction: Todd W. Buley, based in Mesa, AZ, is an accomplished inventor with a total of three patents to his name. His contributions to the field of chemical mechanical planarization (CMP) have greatly enhanced the efficiency and effectiveness of semiconductor manufacturing processes.
Latest Patents: Todd's latest patents include groundbreaking innovations such as a fixed abrasive planarization pad conditioner incorporating chemical vapor deposited polycrystalline diamond and a chemical mechanical planarization system. The fixed abrasive pad conditioner features a polishing pad conditioning head designed for optimal conditioning of CMP polishing pads, essential for maintaining process conditions on dielectric and metal films used in semiconductor wafers. This inventive head includes a substrate with a layer of fine-grain polycrystalline diamond, which can be deposited and bonded using advanced chemical vapor deposition techniques.
The chemical mechanical planarization system focuses on reducing the volume of polishing chemistry in wafer polishing processes. It introduces a rinse bar for the effective removal of polishing chemistry and particulates, alongside a slurry measurement system that regulates the delivery of slurries, ensuring that only minimal amounts of polishing chemistry are utilized during polishing processes.
Career Highlights: Throughout his career, Todd has contributed to significant advancements in CMP technology while working at esteemed organizations, including Motorola Corporation. His work emphasizes the importance of innovation in semiconductor fabrication, resulting in more efficient manufacturing methods that lead to better-performing devices.
Collaborations: Todd has collaborated with notable professionals in the industry, including James F. Vanell and Jerry Wayne Zimmer. Together, they have worked on various projects that aim to push the boundaries of technology and improve the efficiency of semiconductor processes.
Conclusion: Todd W. Buley's innovative contributions to the field of chemical mechanical planarization have significantly impacted semiconductor manufacturing. His dedication to research and development continues to inspire ongoing advancements in the industry, making him a prominent figure in the realm of modern invention.