Ting-Sheng Huang

Title: Innovations of Ting-Sheng Huang in Chemical Mechanical Polishing

Introduction

Ting-Sheng Huang is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of chemical mechanical polishing (CMP). His innovative work has led to the development of a unique CMP conditioner that enhances the efficiency of the polishing process.

Latest Patents

Ting-Sheng Huang holds a patent for a "Chemical mechanical polishing conditioner and method for manufacturing same." This invention comprises a bottom substrate, an intermediate substrate, and a diamond film. The intermediate substrate features a hollow portion and an annular portion surrounding it, with at least one projecting ring that extends away from the bottom substrate. The projecting ring includes a series of bumps arranged in a radial direction, which are designed to conform to the diamond film, creating multiple abrasive projections. This innovative design improves the effectiveness of the CMP process.

Career Highlights

Ting-Sheng Huang has been associated with Kinik Company, where he has applied his expertise in developing advanced polishing technologies. His work has been instrumental in enhancing the performance of CMP tools used in various industries.

Collaborations

Ting-Sheng Huang has collaborated with talented coworkers, including Jui-Lin Chou and Hsin-Chun Wang. Their combined efforts have contributed to the advancement of CMP technologies and innovations.

Conclusion

Ting-Sheng Huang's contributions to the field of chemical mechanical polishing demonstrate his innovative spirit and dedication to advancing technology. His patent reflects a significant step forward in improving CMP processes, showcasing the importance of innovation in the industry.