Ting Ji

Title: Innovations of Ting Ji in Automatic Sandwich Packaging

Introduction

Ting Ji is an accomplished inventor based in Nantong, China. He has made significant contributions to the field of food packaging technology. His innovative designs focus on improving efficiency and accuracy in sandwich packaging processes.

Latest Patents

Ting Ji holds a patent for a "Bread slice delivery device for automatic sandwich packaging machine." This device is designed to ensure that bread slices are delivered accurately and that sandwich layers remain aligned during the packaging process. The device consists of several components, including a base plate, a bread receptacle base, a bread receptacle, three ball screw-type linear slide platforms, three L-shaped brackets, a rectangular push plate, two flat carrier plates, one photoelectric switch, and six proximity switches. This invention enhances the reliability of sandwich packaging by allowing for easy swapping of the bread storage receptacle.

Career Highlights

Ting Ji is affiliated with Nantong University, where he continues to work on innovative projects related to food technology. His dedication to research and development has positioned him as a key figure in his field.

Collaborations

Ting Ji collaborates with talented individuals such as Liang Hua and Yusong Zhou, who contribute to his projects and research endeavors.

Conclusion

Ting Ji's work in the field of automatic sandwich packaging showcases his innovative spirit and commitment to enhancing food technology. His contributions are paving the way for more efficient packaging solutions in the industry.