Ting Cai

Title: Ting Cai: Innovator in Semiconductor Technology

Introduction

Ting Cai is a prominent inventor based in Shanghai, China. She has made significant contributions to the field of semiconductor technology, particularly in enhancing the adhesion between metal and dielectric layers in semiconductor devices.

Latest Patents

Ting Cai holds a patent for a method titled "Method for BEOL metal to dielectric adhesion." This innovative method promotes adhesion between a dielectric layer of a semiconductor device and a metal fill deposited within a trench in the dielectric layer. The process involves performing an ion implantation process, where an ion beam formed of an ionized dopant species is directed into the trench at an acute angle relative to the top surface of the dielectric layer. This technique forms an implantation layer in the sidewall of the trench, allowing for improved adhesion when a metal fill is deposited atop an underlying bottom metal layer.

Career Highlights

Ting Cai is currently employed at Applied Materials, Inc., a leading company in the semiconductor industry. Her work focuses on developing advanced materials and processes that enhance the performance and reliability of semiconductor devices.

Collaborations

Ting has collaborated with notable colleagues, including Qintao Zhang and Jun-Feng Lu, who contribute to her innovative projects and research endeavors.

Conclusion

Ting Cai's work in semiconductor technology exemplifies her commitment to innovation and excellence. Her patent on metal to dielectric adhesion is a testament to her expertise and impact in the field.