Company Filing History:
Years Active: 2016-2017
Introduction
Timo J Tick, based in Rueschlikon, Switzerland, is an esteemed inventor known for his pioneering contributions to the field of electronic circuitry. With two patents to his name, Timo is making significant strides in optimizing substrate devices for modern technology.
Latest Patents
Timo J Tick's latest innovations include a groundbreaking patent for a substrate device and an electric circuit arrangement featuring a first substrate section that is perpendicular to a second substrate section. The design incorporates a first plurality of layers with a specific orientation and a second plurality of layers with a different orientation, showcasing the inventive configuration that enhances electronic performance.
In another impressive patent, Timo developed a substrate device that allows for increased functionality within electronic circuits or devices. By positioning the first and second substrate sections at an angle to one another, his design promises to improve the efficiency and capability of electronic devices.
Career Highlights
As a dedicated inventor at the International Business Machines Corporation (IBM), Timo J Tick applies his expertise in electrical engineering and material science to develop innovative solutions. His work at IBM places him at the forefront of technology advancement, particularly in substrates used for advanced electronic devices.
Collaborations
In his professional journey, Timo has worked alongside notable colleagues such as Thomas J Brunschwiler and Dominic Gschwend. This collaborative environment fosters creativity and innovation, allowing Timo to draw from a wealth of knowledge and experience to refine his inventions.
Conclusion
Timo J Tick stands out as a remarkable inventor within the realm of electronic circuitry. His patents reflect a commitment to advancing technology and improving electronic devices through innovative substrate arrangements. As he continues to work at IBM, Timo is poised to inspire future innovations in the field.