Company Filing History:
1 out of 832,966 Years Active: 2013
Title: Tim Rossner - Innovator in Microcomponent Contacting Technology
Introduction
Tim Rossner is a notable inventor based in Alzenau, Germany. He has made significant contributions to the field of microcomponent technology, particularly in the area of electrical wiring. His innovative approach has led to the development of a unique method that enhances the efficiency of contacting insulated wires.
Latest Patents
Tim Rossner holds a patent for a "Method for the miniaturizable contacting of insulated wires." This invention allows for the contacting of microcomponents using electrical wires. By growing metallic microdepositions on cut surfaces of microcables, a contact region is generated. This simplifies the dosing and application of a contact auxiliary and allows for ultrasonic bonding. The method ensures a defined size of the electrically conductive area, enabling the stable contacting of insulated wires. Additionally, the application of this method in a panelized manner and in series is cost-effective.
Career Highlights
Throughout his career, Tim Rossner has focused on advancing technologies that improve the functionality and reliability of microcomponents. His work has been instrumental in developing methods that facilitate better electrical connections in various applications. With a patent portfolio that includes one significant patent, he continues to push the boundaries of innovation in his field.
Collaborations
Tim Rossner has collaborated with Thorsten Meiss, working together to explore new avenues in microcomponent technology. Their partnership has fostered an environment of creativity and innovation, leading to advancements in their respective areas of expertise.
Conclusion
Tim Rossner's contributions to the field of microcomponent contacting technology highlight his innovative spirit and dedication to improving electrical connections. His patented method represents a significant advancement in the industry, showcasing the potential for further developments in microcomponent applications.