Company Filing History:
Years Active: 2016
Title: Tim Oliver Stadelmann: Innovator in Semiconductor Chip Inspection
Introduction
Tim Oliver Stadelmann is a notable inventor based in Kreuzlingen, Switzerland. He has made significant contributions to the field of semiconductor technology, particularly in the area of chip handling and inspection. His innovative approach has led to the development of a unique method and apparatus that enhances the efficiency of semiconductor chip bonding processes.
Latest Patents
Tim Oliver Stadelmann holds a patent for a "Method and apparatus for inspecting a semiconductor chip prior to bonding." This invention presents a chip handling apparatus that includes a chip supply station, a chip mounting station, and one or more chip handling units. These units are designed to pick a chip from the supply station, transport it to the mounting station, and place it at a designated mounting location. Each chip handling unit is capable of temporarily retaining the chip in a defined position. Additionally, the apparatus incorporates means for inducing sonic vibrations in the chip while it is retained, as well as means for measuring these vibrations.
Career Highlights
Stadelmann is currently employed at Kulicke and Soffa Die Bonding GmbH, where he continues to work on advancing semiconductor technologies. His expertise in chip handling and inspection has positioned him as a valuable asset in the industry.
Collaborations
One of his notable coworkers is Andreas Marte, with whom he collaborates on various projects related to semiconductor technology.
Conclusion
Tim Oliver Stadelmann's contributions to semiconductor chip inspection demonstrate his innovative spirit and commitment to advancing technology in this critical field. His patent reflects a significant step forward in improving the efficiency and effectiveness of chip bonding processes.