Neu-Ulm, Germany

Tim Braeunig


Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2021

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Tim Braeunig: Innovator in Blister Pack Technology

Introduction

Tim Braeunig is a notable inventor based in Neu-Ulm, Germany. He has made significant contributions to the field of packaging technology, particularly in the area of blister packs. His innovative approach has led to the development of a unique device and method for transferring blister packs, which enhances efficiency in packaging processes.

Latest Patents

Tim Braeunig holds a patent for a "Device and method for transferring blister packs." This invention involves a sophisticated mechanism where two blister packs are initially transferred from a stamping station to an intermediate place element. Subsequently, they are moved from this intermediate element to a single-file conveying means. The design allows for both blister packs to be positioned next to each other, ensuring a streamlined transfer process. During this transfer, the packs are rotated 180 degrees and acquire a lateral offset, optimizing their placement for further processing.

Career Highlights

Braeunig is associated with Uhlmann Pac-Systeme GmbH & Co. KG, a company renowned for its innovative packaging solutions. His work has been instrumental in advancing the technology used in the packaging industry, particularly in the efficient handling of blister packs. His patent reflects his commitment to improving operational efficiency and product handling.

Collaborations

Tim Braeunig has collaborated with notable colleagues such as Bernd Haehnel and Andreas Armbruster. Their combined expertise has contributed to the successful development and implementation of innovative packaging solutions.

Conclusion

Tim Braeunig's contributions to blister pack technology exemplify the impact of innovation in the packaging industry. His patent and work at Uhlmann Pac-Systeme GmbH & Co. KG highlight his role as a key player in advancing packaging solutions.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…