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Endwell, NY, United States of America

Tien Y Wu

USPTO Granted Patents = 8

Average Co-Inventor Count = 4.4

ph-index = 6

Forward Citations = 217(Granted Patents)

Company Filing History:

8 out of 164,108

International Business Machines Corporation

Years Active: 1994-2002

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8 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 6403882 - Protective cover plate for flip chip assembly backside (2002-06-11),

2. 6226187 - Integrated circuit package (2001-05-01),

3. 6084299 - Integrated circuit package including a heat sink and an adhesive (2000-07-04),

4. 5574630 - Laminated electronic package including a power/ground assembly (1996-11-12),

5. 5532024 - Method for improving the adhesion of polymeric adhesives to nickel (1996-07-02),

6. 5491610 - Electronic package having active means to maintain its operating (1996-02-13),

7. 5442144 - Multilayered circuit board (1995-08-15),

8. 5359767 - Method of making multilayered circuit board (1994-11-01),

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