Company Filing History:
Years Active: 1994-2002
Title: The Innovations of Tien Y Wu
Introduction
Tien Y Wu is a notable inventor based in Endwell, NY (US), recognized for his contributions to the field of semiconductor technology. With a total of 8 patents to his name, Wu has made significant advancements in the design and functionality of integrated circuit packages.
Latest Patents
Among his latest patents is a protective cover plate for flip chip assembly backside. This innovative chip package includes a die with an active surface and an inactive surface. An adhesive with a low Young's modulus of elasticity is formed on the inactive surface, which may be 10,000 psi or less, or preferably about 1,000 psi. The adhesive may also incorporate a thermal conducting material. Additionally, a protective plate is coupled to the inactive surface using the adhesive, while a chip carrier is attached to the active surface of the die. Another significant patent involves an integrated circuit package that improves the bond strength between a semiconductor chip and a metal heat sink. This is achieved through an adhesive system comprising two separate layers, each exhibiting preferential bonding strength for the chip and the metal heat sink.
Career Highlights
Wu is currently employed at International Business Machines Corporation (IBM), where he continues to innovate and develop new technologies. His work has had a profound impact on the semiconductor industry, enhancing the performance and reliability of electronic devices.
Collaborations
Throughout his career, Tien Y Wu has collaborated with esteemed colleagues, including William T Chen and Thomas P Gall. These partnerships have fostered a creative environment that has led to groundbreaking advancements in their field.
Conclusion
Tien Y Wu's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the industry. His innovative solutions continue to shape the future of electronic devices.