Tic Medina

Title: Tic Medina: Innovator in Image Sensor Packaging

Introduction

Tic Medina is a notable inventor based in Hayward, CA (US). He has made significant contributions to the field of image sensor technology, particularly in the area of packaging techniques. His innovative approach aims to enhance the efficiency and yield of image-sensor modules.

Latest Patents

Tic Medina holds a patent for "Techniques for glass attachment in an image sensor package." This patent describes a low-cost wafer-level packaging (WLP) method for attaching glass to optical image-sensor devices on a semiconductor wafer. The method is designed to increase the yield of image-sensor modules during later assembly steps. One embodiment of the patent relates to applications with image sensors and microlenses fabricated on a wafer. A glass wafer is singulated, aligned to mirror the die pattern on an image-sensor wafer, and then bonded to the image-sensor wafer. This process ensures that optical adhesive forms a layer between each image sensor and its glass cover. Another embodiment applies cavity walls to singulated glass covers, which are then attached to image sensors formed on a single wafer. The wafer can subsequently be singulated to form a plurality of image sensor packages.

Career Highlights

Tic Medina is currently employed at Flextronics Ap, LLC, where he continues to innovate in the field of image sensor technology. His work has been instrumental in developing cost-effective solutions that improve the performance of image sensors.

Collaborations

Tic has collaborated with talented individuals such as Harpuneet Singh and Liqun Larry Wang. Their combined expertise has contributed to advancements in the technology surrounding image sensors.

Conclusion

Tic Medina's contributions to the field of image sensor packaging demonstrate his commitment to innovation and efficiency. His patent for glass attachment techniques is a testament to his ingenuity and the impact he has made in the industry.