Tianzong Xu

Title: Innovations of Tianzong Xu in Integrated Etch Processes

Introduction

Tianzong Xu is a notable inventor based in Mountain View, CA, who has made significant contributions to the field of semiconductor manufacturing. His work primarily focuses on innovative etching processes that enhance the efficiency and effectiveness of integrated circuits.

Latest Patents

Tianzong Xu holds a patent for an "In-situ integrated oxide etch process particularly useful for copper dual damascene." This patent describes a sophisticated integrated in situ oxide etch process that is particularly beneficial for a counterbore dual-damascene structure over copper. The process involves multiple layers, including a lower nitride stop layer, lower oxide dielectric, upper oxide dielectric layer, and an anti-reflective coating (ARC). The etching process is divided into a counterbore etch and a trench etch, each performed in a high-density plasma reactor. The detailed steps ensure precision and selectivity, particularly in managing the interactions between different materials.

Career Highlights

Tianzong Xu is currently employed at Applied Materials, Inc., a leading company in the semiconductor equipment industry. His expertise in etching processes has positioned him as a valuable asset in the development of advanced manufacturing techniques. His innovative approaches have contributed to the efficiency of semiconductor fabrication.

Collaborations

Tianzong has collaborated with notable colleagues, including Hoiman Raymond Hung and Joseph P. Caulfield. These collaborations have fostered a productive environment for innovation and have led to advancements in semiconductor technology.

Conclusion

Tianzong Xu's contributions to integrated etch processes exemplify the importance of innovation in the semiconductor industry. His patent and work at Applied Materials, Inc. highlight his role in advancing technology that is crucial for modern electronics.