Tianping Lv

Title: Innovations of Tianping Lv

Introduction

Tianping Lv is a notable inventor based in Chengdu, China. He has made significant contributions to the field of semiconductor technology, particularly in the development of power MOSFET devices. With a total of 3 patents to his name, his work has garnered attention in the industry.

Latest Patents

One of his latest patents is titled "Power MOSFET with metal filled deep sinker contact." This invention involves a method of forming an integrated circuit that includes a power semiconductor device. The process begins with providing a substrate that has an epi layer, where at least one transistor is formed and covered by a pre-metal dielectric layer. Contact openings are etched through the PMD into the epi layer, creating a sinker trench that extends to a first node of the device. A metal fill material is deposited to cover the sidewall and bottom of the sinker trench, but it does not completely fill it. A dielectric filler layer is then deposited over the metal fill material to fill the trench, and an overburden region is removed to form a sinker contact. Finally, a patterned interconnect metal is formed to connect the interconnect metal and the metal fill material on the sidewall of the sinker trench.

Another significant patent is "Power MOSFET with metal filled deep source contact." This planar gate power MOSFET includes a substrate with a semiconductor surface doped with a first conductivity type. It features a plurality of transistor cells, each having a gate stack over a body region. A trench with an aspect ratio greater than 3 extends down from the top side of the semiconductor surface between the gate stacks, providing a source contact from a source doped with a second conductivity type to the substrate. A field plate is positioned over the gate stacks, providing a liner for the trench, which contains a refractory metal or platinum-group metal filler. A drain doped with the second conductivity type is located in the semiconductor surface on the side of the gate stacks opposite the trench.

Career Highlights

Tianping Lv is currently employed at Texas Instruments Corporation, where he continues to innovate in the semiconductor field. His work has been instrumental in advancing power MOSFET technology, which is crucial for various electronic applications.

Collaborations

He has collaborated with notable coworkers, including Yunlong Liu and Ho Lin, contributing to the