Kisslegg, Germany

Thomas M Zwick


Average Co-Inventor Count = 3.6

ph-index = 5

Forward Citations = 98(Granted Patents)


Company Filing History:


Years Active: 2007-2014

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9 patents (USPTO):

Title: The Remarkable Contributions of Inventor Thomas M. Zwick

Introduction: Thomas M. Zwick, an innovative inventor based in Kisslegg, Germany, has significantly impacted the field of semiconductor technology with his impressive portfolio of nine patents. His work primarily focuses on the integration of integrated circuit (IC) chips with antennas, a vital advancement for millimeter wave applications in modern communication systems.

Latest Patents: Among his recent patents are groundbreaking inventions including “Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires.” This patent outlines methods to package semiconductor IC chips with antennas that incorporate radiating and tuning elements formed from the lead wires of the package. These advancements play a crucial role in enabling millimeter wave applications. Another notable patent is titled “Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications.” This invention presents methods to combine antennas with IC chips, promoting the development of highly integrated and efficient communication systems across various applications, including voice and data communication as well as radar technology.

Career Highlights: Thomas M. Zwick is a distinguished member of International Business Machines Corporation (IBM), where he contributes to transformative innovations in semiconductor packaging technology. His expertise and commitment to advancing communication technology have earned him recognition in the field.

Collaborations: Throughout his career, Zwick has collaborated with talented individuals such as Brian Paul Gaucher and Duixian Liu. Their combined efforts have further elevated the innovative projects at IBM, showcasing the power of teamwork in achieving groundbreaking technological advancements.

Conclusion: Thomas M. Zwick's pivotal role in the development of advanced packaging techniques for integrated circuit chips demonstrates his commitment to innovation and excellence in the realm of semiconductor technology. His patents not only reflect his ingenuity but also enhance the future of communication systems, ensuring the continued advancement of technology in our lives.

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