Thomas H Ramsey

Title: Innovations by Thomas H. Ramsey

Introduction

Thomas H. Ramsey is a notable inventor based in Garland, TX (US). He has made significant contributions to the field of integrated circuits, holding a total of 6 patents. His work focuses on improving the reliability and efficiency of electrical connections in semiconductor devices.

Latest Patents

Among his latest patents, one is titled "Method for obtaining metallurgical stability in integrated circuit." This invention describes a method for electrically connecting integrated circuit copper-gold ball bonds that connect a bond wire with a bond pad. The process involves forming a palladium layer in the electrical connection, which helps avoid excessive stresses caused by intermetallic formations. Another significant patent is the "Ultrasonic bonding process beyond 125 kHz." This invention provides a method for bonding wire to the bond sites of integrated circuits, particularly using gold wire bonded to aluminum bond pads. The apparatus includes a high-frequency ultrasonic energy source designed to operate at frequencies above 125 kHz, optimizing the bond's shear strength and processing parameters.

Career Highlights

Thomas H. Ramsey is currently employed at Texas Instruments Corporation, where he continues to innovate in the field of semiconductor technology. His work has been instrumental in addressing challenges related to intermetallic formation and bond strength in integrated circuits.

Collaborations

Throughout his career, Thomas has collaborated with several talented individuals, including Rafael C. Alfaro and Lau B. Howe. These collaborations have contributed to the advancement of technologies in the semiconductor industry.

Conclusion

Thomas H. Ramsey's contributions to integrated circuit technology through his patents and work at Texas Instruments Corporation highlight his role as a key innovator in the field. His inventions continue to enhance the reliability and performance of electronic devices.