Thomas G Fletcher

Title: Thomas G Fletcher: Innovator in Multi-Chip Module Assembly

Introduction

Thomas G Fletcher is a notable inventor based in Waterdown, Canada. He has made significant contributions to the field of electronics, particularly in the design and configuration of multi-chip module assemblies. His innovative approach has led to advancements that enhance circuit density and flexibility in electronic designs.

Latest Patents

Fletcher holds a patent for a "Three dimensional packaging configuration for multi-chip module assembly." This invention features a multi-chip module (MCM) assembly with three stacked integrated circuit (IC) layers. The first IC layer is electrically flip-chip connected to a substrate, while the second IC layer is glued to the back of the first. The second and third IC layers are also electrically flip-chip connected to each other. This design allows for high circuit density and lower electrical noise susceptibility, accommodating various IC sizes and technologies within a single assembly.

Career Highlights

Fletcher has worked at Gennum Corporation, where he has been instrumental in developing cutting-edge technologies in the electronics sector. His work has focused on improving the efficiency and performance of multi-chip assemblies, making significant strides in the industry.

Collaborations

Throughout his career, Fletcher has collaborated with talented individuals such as Robert E Hawke and Atin J Patel. These partnerships have fostered innovation and contributed to the success of various projects within the company.

Conclusion

Thomas G Fletcher's contributions to the field of multi-chip module assembly have paved the way for advancements in electronic design. His innovative patent and collaborative efforts highlight his commitment to enhancing technology in the electronics industry.