Location History:
- Dayton, OH (US) (2000)
- Kettering, OH (US) (1995 - 2001)
Company Filing History:
Years Active: 1995-2001
Title: Innovations of Thomas C Miller, Jr.
Introduction
Thomas C Miller, Jr. is a notable inventor based in Kettering, OH (US). He holds a total of 7 patents that showcase his contributions to the field of thermal transfer technology. His work has significantly impacted the efficiency and functionality of thermal transfer ribbons.
Latest Patents
Among his latest patents is a design for thermal transfer ribbons that incorporate large size wax or resin particles. This innovation allows for a profiled surface that resists the transfer of the thermal layer to the reverse side of the ribbon when it is wound onto itself and stored. The large particles, with an average diameter ranging from 5 to 20 microns, enhance the performance of the thermal transfer layers, which are designed to be thinner than the average diameter of these particles. Additionally, he has developed a thermal transfer ribbon with paper leaders and trailers. This design features a polyester substrate that employs paper leaders and trailers with printed indicia, providing clear identification and usage instructions for the thermal transfer ribbons.
Career Highlights
Thomas C Miller, Jr. is currently associated with NCR Corporation, where he continues to innovate and develop new technologies. His work at NCR Corporation has allowed him to apply his expertise in thermal transfer technology to create practical solutions for various applications.
Collaborations
Throughout his career, Miller has collaborated with notable colleagues, including Thomas J Obringer and Richard D Puckett. These collaborations have contributed to the advancement of thermal transfer technologies and have fostered a productive working environment.
Conclusion
Thomas C Miller, Jr. is a distinguished inventor whose innovations in thermal transfer technology have made a significant impact in the industry. His patents reflect a commitment to enhancing the functionality and efficiency of thermal transfer ribbons.