Company Filing History:
Years Active: 2022-2023
Title: Thiago Chaves: Innovator in 3D Object Representation
Introduction
Thiago Chaves is a notable inventor based in Recife, Brazil. He has made significant contributions to the field of three-dimensional object representation, holding 2 patents that showcase his innovative approach to technology.
Latest Patents
Chaves' latest patents include "Determination of vertices of triangular grids for three-dimensional object representations." This invention involves a non-transitory computer-readable medium that stores machine-readable instructions. These instructions enable a processor to receive a 3D object representation and subdivide it into a triangular grid. The invention also calculates curved triangles for the triangles in the grid and assesses differences between the curved triangles and the original 3D object representation. Another significant patent is "Determination of modeling accuracy between three-dimensional object representations." This patent describes a computer-readable medium that stores instructions for a processor to receive 3D object representations. It calculates a sampling error based on the distance between grid points and random points on the 3D object representation, which is essential for determining modeling accuracy.
Career Highlights
Throughout his career, Thiago Chaves has worked with prominent organizations such as Hewlett-Packard Development Company, L.P. and Universidade Federal de Pernambuco. His experience in these institutions has allowed him to refine his skills and contribute to groundbreaking projects in the field of 3D modeling.
Collaborations
Chaves has collaborated with talented individuals, including Diogo Henriques and Francisco Simoes. These partnerships have fostered a creative environment that has led to innovative solutions in technology.
Conclusion
Thiago Chaves is a distinguished inventor whose work in 3D object representation has made a significant impact in the field. His patents reflect his dedication to advancing technology and improving modeling accuracy.