Company Filing History:
1 out of 832,880 Years Active: 2001
Title: Theis Zur Nieden: Innovator in Multilayer Connecting Substrates
Introduction
Theis Zur Nieden is a notable inventor based in Schoenaich, Switzerland. He has made significant contributions to the field of multilayer connecting substrates, showcasing his expertise through innovative patent designs. His work focuses on the integration of various functions within a single substrate, enhancing the efficiency and performance of electronic circuits.
Latest Patents
Theis Zur Nieden holds a patent for a method of manufacturing multilayer connecting substrates with multiple functions. This patent outlines a design approach that separates the functional aspects of the substrate into distinct modules. The method involves planning and optimizing signal conducting, power supplying, and mechanical substrate parts independently. The final design integrates these modules into an overall circuit, ensuring that the inner and outer areas of the circuit are effectively utilized. The resulting multilayer circuit features a conductor network, components, and mechanical stiffening elements, providing both flexibility and rigidity where needed.
Career Highlights
Throughout his career, Theis Zur Nieden has demonstrated a commitment to advancing technology in the field of electronic substrates. His innovative approach to design and manufacturing has positioned him as a key figure in the industry. With a focus on functionality and efficiency, he continues to push the boundaries of what is possible in multilayer circuit design.
Collaborations
Theis has collaborated with notable professionals in his field, including Hans-Jürg Barte and Ewald Losert. These partnerships have contributed to the development of his innovative ideas and patents, fostering a collaborative environment for technological advancement.
Conclusion
Theis Zur Nieden is a distinguished inventor whose work in multilayer connecting substrates has made a significant impact on the electronics industry. His innovative methods and collaborative spirit continue to inspire advancements in technology.