Osaka, Japan

Tetsuyuki Watanabe

USPTO Granted Patents = 1 

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 56(Granted Patents)


Company Filing History:


Years Active: 2001

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1 patent (USPTO):Explore Patents

Title: Tetsuyuki Watanabe: Innovator in Thermal Conductivity

Introduction

Tetsuyuki Watanabe is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of thermal conductivity through his innovative designs and patents. His work focuses on improving heat transfer efficiency, which is crucial in various technological applications.

Latest Patents

Watanabe holds a patent for a "Thermal conductive unit and thermal connection structure using the same." This invention features a heat conducting member made from a material with excellent heat conductivity, shaped to correspond with the heat path. The design includes a container made of a flexible sheet, which houses the heat conducting member. This configuration connects at least two parts at different temperatures, facilitating efficient heat transfer from a higher-temperature part to a lower-temperature part. The heat is then dissipated away from the lower-temperature part, effectively cooling the higher-temperature component.

Career Highlights

Watanabe is associated with Matsushita Electric Industrial Co., Ltd., a company known for its commitment to innovation and quality in electronics. His work has contributed to advancements in thermal management technologies, which are essential for enhancing the performance and longevity of electronic devices.

Collaborations

Watanabe has collaborated with esteemed colleagues such as Norio Fujiwara and Yasuhiro Akiba. Their combined expertise has fostered a productive environment for innovation and development in their respective fields.

Conclusion

Tetsuyuki Watanabe's contributions to thermal conductivity through his patent and work at Matsushita Electric Industrial Co., Ltd. highlight his role as a significant inventor in the industry. His innovative approach to heat transfer continues to influence technological advancements.

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