Company Filing History:
1 out of 832,761 Years Active: 2003
Title: The Innovations of Tetsuya Mieda
Introduction
Tetsuya Mieda is a notable inventor based in Nagoya, Japan. He has made significant contributions to the field of semiconductor technology. His work focuses on enhancing the performance and reliability of semiconductor devices.
Latest Patents
Mieda holds a patent for a semiconductor-sealing resin composition and a semiconductor device utilizing this innovation. The resin composition is designed for sealing semiconductor devices and contains a filler of spherical fused silica with a maximum particle size of not larger than 45 µm. Additionally, it may include metal impurities with a particle size of not larger than 53 µm. This invention aims to improve the durability and efficiency of semiconductor devices.
Career Highlights
Throughout his career, Mieda has demonstrated a commitment to advancing semiconductor technology. His innovative approaches have led to practical solutions that address common challenges in the industry. His patent reflects his expertise and dedication to improving semiconductor performance.
Collaborations
Mieda has collaborated with notable colleagues, including Yasuaki Tsutsumi and Masayuki Tanaka. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.
Conclusion
Tetsuya Mieda's contributions to semiconductor technology through his patent highlight his role as an influential inventor. His work continues to impact the industry positively, showcasing the importance of innovation in technology.