Company Filing History:
Years Active: 2012
Title: Tetsuya Ezaki: Innovator in Photosensitive Thermosetting Resin Technology
Introduction
Tetsuya Ezaki is a notable inventor based in Kawaguchi, Japan. He has made significant contributions to the field of materials science, particularly in the development of photosensitive thermosetting resin compositions. His innovative work has implications for various applications, including flexible printed circuit boards.
Latest Patents
Tetsuya Ezaki holds a patent for a photosensitive thermosetting resin composition and a flexible printed circuit board. This invention provides a halogen-free coating film with high-level flame retardancy. The resin composition is characterized by its low warpage property after curing, along with excellent plasticity, resolution, soldering heat resistance, and chemical resistance. The composition includes a resin component with a (meth)acryloyl group and a carboxyl group, a phosphorus-containing epoxy thermosetting resin, a photopolymerization initiator, an organophosphorus compound, and a diluent. This innovative formulation addresses the issues associated with conventional brominated epoxy resin compositions, particularly the generation of harmful hydrogen bromide during combustion.
Career Highlights
Tetsuya Ezaki is currently associated with Kyocera Chemical Corporation, where he continues to advance his research and development efforts. His work has positioned him as a key figure in the field of thermosetting resins, contributing to the evolution of safer and more efficient materials.
Collaborations
Tetsuya has collaborated with notable colleagues, including Masakazu Fujiwara and Masanobu Yanahara. These partnerships have fostered a collaborative environment that enhances innovation and drives the development of new technologies.
Conclusion
Tetsuya Ezaki's contributions to the field of photosensitive thermosetting resins exemplify the importance of innovation in material science. His work not only addresses current challenges but also paves the way for future advancements in flexible printed circuit board technology.