Location History:
- Amagasaki, JP (1991)
- Tokyo, JP (1998)
Company Filing History:
2 out of 21,351 
1 out of 3 Years Active: 1991-1998
Title: Teruo Nakanishi: Innovator in Copper Alloys
Introduction
Teruo Nakanishi is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of materials science, particularly in the development of copper alloys for electronic components. With a total of 2 patents, his work has had a notable impact on the industry.
Latest Patents
Nakanishi's latest patents include a copper alloy designed for electronic parts, which excels in adhesion of silver (Ag) and reliability of solderability and plating adhesion. This invention maintains the excellent strength and electrical conductivity of a copper-nickel-silicon alloy. The specific composition of this copper alloy consists of 1.7 to 4.0% by weight of nickel, 0.3 to 0.8% by weight of silicon, 0.002 to 0.3% by weight of silver, 0.5 to 2.0% by weight of zinc, with the remainder being copper. Additionally, he has developed a Cu-Ni-Sn alloy that boasts excellent fatigue properties, comprising 6 to 25 wt % of nickel, 4 to 9 wt % of tin, and a total of 0.04 to 5 wt % of selected additional elements.
Career Highlights
Throughout his career, Nakanishi has worked with notable companies such as Mitsubishi Denki Kabushiki Kaisha and Mitsubishi Electric Metecs Co., Ltd. His experience in these organizations has allowed him to refine his expertise in alloy development and electronic components.
Collaborations
Nakanishi has collaborated with esteemed colleagues, including Kenji Kubozono and Kimio Hashizume. Their joint efforts have contributed to advancements in the field of materials science.
Conclusion
Teruo Nakanishi's innovative work in copper alloys has significantly influenced the electronics industry. His patents reflect a commitment to enhancing the performance and reliability of electronic components.