Teng Mao Wang

Title: Innovations of Teng Mao Wang

Introduction

Teng Mao Wang is a notable inventor based in Tainan, Taiwan. He has made significant contributions to the field of thin film formation using plasma technology. His innovative approach has led to the development of a unique process kit that enhances the efficiency of substrate support systems.

Latest Patents

Teng Mao Wang holds a patent for a groundbreaking invention titled "Ground return for thin film formation using plasma." This patent describes a process kit that includes a substrate support and one or more electrical connectors. Each electrical connector is designed with a tube and a shaft that features a rim positioned inside the tube. The shaft consists of a first portion above the rim and a second portion below the rim, allowing for movement outside the tube. Additionally, the design incorporates a seal, with the rim directly underlying a portion of the seal. This innovative design aims to improve the functionality and reliability of thin film formation processes.

Career Highlights

Teng Mao Wang is currently employed at Applied Materials, Inc., a leading company in the field of materials engineering. His work at Applied Materials has allowed him to collaborate with other talented professionals and contribute to cutting-edge technologies in the industry.

Collaborations

Some of Teng Mao Wang's coworkers include Cheng-Yuan Lin and Hsiang An. Their collaborative efforts have further advanced the research and development of innovative solutions in the field of thin film technology.

Conclusion

Teng Mao Wang's contributions to the field of plasma technology and thin film formation are noteworthy. His patent and work at Applied Materials, Inc. reflect his commitment to innovation and excellence in engineering.