Teng Liu

Title: Innovations of Teng Liu in Variable Selective Etching Technology

Introduction

Teng Liu is a prominent inventor based in Chengdu, China. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent related to variable selective etching technology for thick Silicon-On-Insulator (SOI) devices. His work is crucial for advancing the manufacturing processes of SOI materials.

Latest Patents

Teng Liu holds a patent for a new variable selective etching technology for thick SOI devices. This technology involves a series of steps that enhance the etching process, including the use of a composite hard mask with a variable selection ratio. The method improves the etching of SOI materials by preventing damage to the side walls of deep trenches during the etching of buried oxide layers. This innovation eliminates the need for excessively thick hard masks, thereby streamlining the manufacturing process.

Career Highlights

Teng Liu is affiliated with the University of Electronic Science and Technology of China, where he continues to engage in research and development in semiconductor technologies. His expertise in etching technologies has positioned him as a valuable asset in the academic and industrial sectors.

Collaborations

Teng Liu has collaborated with notable colleagues, including Bo Zhang and Wentong Zhang. Their combined efforts contribute to the advancement of research in the field of semiconductor technology.

Conclusion

Teng Liu's innovative work in variable selective etching technology represents a significant advancement in the semiconductor industry. His contributions not only enhance manufacturing processes but also pave the way for future innovations in SOI device technology.