Singapore, Singapore

Teck Keong Boh

USPTO Granted Patents = 2 

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2014-2019

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2 patents (USPTO):Explore Patents

Title: Teck Keong Boh: Innovator in Solar Technology and Integrated Circuit Packaging

Introduction

Teck Keong Boh is a prominent inventor based in Singapore, known for his contributions to solar technology and integrated circuit packaging. With a total of 2 patents, he has made significant strides in enhancing manufacturing processes in these fields.

Latest Patents

One of Teck Keong Boh's latest patents is the "Laser Scribing of Thin-Film Solar Cell Panel." This innovative method involves loading a workpiece with a transparent substrate facing downwards in an input station. The process includes biasing a reference edge of the workpiece against stoppers, translating the workpiece back and forth, and firing multiple laser beams to scribe parallel lines on the front electrodes. This technique aims to improve the efficiency of solar cell panel manufacturing.

Another notable patent is the "Adaptive Clamp Width Adjusting Device." This invention describes a device for use in integrated circuit package process machines. It features a travel component that carries a clamp with adjustable width, operable by a driven wheel. The fixed component includes a motor and a drive wheel, allowing for precise adjustments based on the width of the workpiece.

Career Highlights

Teck Keong Boh works at Manufacturing Integration Technology Ltd., where he applies his expertise in developing innovative solutions for manufacturing processes. His work has significantly impacted the efficiency and effectiveness of production in the technology sector.

Collaborations

Teck Keong Boh collaborates with talented individuals such as Kim Mone Kwong and Xiang Zhang, contributing to a dynamic work environment that fosters innovation and creativity.

Conclusion

Teck Keong Boh's contributions to solar technology and integrated circuit packaging demonstrate his commitment to innovation and excellence in manufacturing. His patents reflect a deep understanding of the challenges in these fields and a dedication to finding effective solutions.

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