Company Filing History:
Years Active: 1997-2003
Title: Innovations of Te-Sung Wu
Introduction
Te-Sung Wu is a notable inventor based in New Providence, NJ (US). He has made significant contributions to the field of materials science, particularly in the area of metal deposition processes. With a total of 4 patents to his name, Wu's work has advanced the techniques used in electroless plating and electroplating.
Latest Patents
One of Wu's latest patents is a process for the electroless deposition of metal on a substrate. This innovative process allows for the metalization of substrates, either as a complete coating or in a patternwise manner. The method involves forming a pattern of resist material on the substrate and depositing metal in the defined interstices. The substrate is treated with reagents that promote electroless plating, and after the resist material is removed, the substrate is exposed to an electroless plating bath to form nickel on the treated areas. The substrate is then heated to at least 180°C to facilitate the formation of additional metal layers.
Another significant patent involves the electroplating of nickel on nickel ferrite devices. Wu discovered that boric acid in conventional nickel plating baths caused excessive lateral growth on ferrite substrates. By eliminating boric acid and using citric acid as a plating buffer, he achieved isotropic nickel plating, resulting in a wire-bondable surface.
Career Highlights
Throughout his career, Te-Sung Wu has worked with prominent companies such as Lucent Technologies Inc. and Agere Systems Inc. His expertise in metal deposition processes has made him a valuable asset in the field of materials science.
Collaborations
Wu has collaborated with notable individuals in his field, including Henry Hon Law and Vincent George Lambrecht, Jr. Their combined efforts have contributed to advancements in the technologies related to metal deposition.
Conclusion
Te-Sung Wu's innovative work in the field of metal deposition has led to significant advancements in electroless and electroplating processes. His contributions continue to influence the industry and pave the way for future innovations.
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