Company Filing History:
Years Active: 1980
Title: Tanjore R Narasimhan: Innovator in Hybrid Packaging Technology
Introduction
Tanjore R Narasimhan is a notable inventor based in Farmingville, NY (US). He has made significant contributions to the field of electronics through his innovative designs and patents. His work focuses on enhancing the efficiency and reliability of electronic components.
Latest Patents
Narasimhan holds a patent for a "Novel hybrid packaging scheme for high density component circuits." This invention presents a hybrid solid-state package that accommodates integrated circuits, precision resistor networks, capacitors, and their interconnections on a multi-layer process substrate. Additionally, thick film resistors and interconnections are provided on a separate substrate. These sub-assemblies are then sandwiched together using film epoxies, resulting in a structure that is significantly smaller and lighter. This design minimizes the number of input-output interconnections compared to conventional designs, all while maintaining quality and reliability.
Career Highlights
Narasimhan is currently associated with ILC Data Device Corporation, where he continues to push the boundaries of technology in electronic packaging. His career is marked by a commitment to innovation and excellence in engineering.
Conclusion
Tanjore R Narasimhan's contributions to hybrid packaging technology exemplify the impact of innovative thinking in the electronics industry. His patent reflects a significant advancement in the design and functionality of high-density component circuits.