Company Filing History:
1 out of 42,508 
1 out of 7 Years Active: 1993
Title: The Innovative Contributions of Tamotu Kirino
Introduction
Tamotu Kirino is a notable inventor based in Oyama, Japan. He has made significant contributions to the field of wire bonding technology, which is essential in the electronics industry. His innovative approach has led to the development of a unique method and apparatus for wire bonding.
Latest Patents
Tamotu Kirino holds a patent for a wire bonding method and apparatus. This invention involves welding a wire with at least one end formed with a ball to a pad of a printed wiring board. The bonding head moves downward slowly to crush the ball, forming a flat surface. It then adjusts the relative position of the pad and the ball before applying ultrasonic waves to heat the ball and the bonding head, ensuring a strong weld. This method enhances the efficiency and reliability of wire bonding processes.
Career Highlights
Throughout his career, Tamotu Kirino has worked with prominent companies such as Hitachi, Ltd. and Hitachi Computer Electronics Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to advancements in technology.
Collaborations
Tamotu Kirino has collaborated with several talented individuals in his field, including Mitsukiyo Tani and Akira Gotoh. These partnerships have fostered innovation and have been instrumental in the development of new technologies.
Conclusion
Tamotu Kirino's contributions to wire bonding technology exemplify the spirit of innovation. His patent and career achievements highlight the importance of collaboration and expertise in driving advancements in the electronics industry.