Location History:
- Hamura, JP (2004)
- Tokyo, JP (2024)
Company Filing History:
Years Active: 2004-2024
Title: Tamanari Yasuda: Innovator in Wire Bonding Technology
Introduction
Tamanari Yasuda is a notable inventor based in Hamura, Japan. He has made significant contributions to the field of wire bonding technology, holding two patents that showcase his innovative methods. His work is particularly relevant in the electronics industry, where precise connections are crucial.
Latest Patents
Yasuda's latest patents include a wire bonding method and a wire bonding apparatus. The wire bonding method allows for the connection of a wire to two different surfaces using a single bonding step. This method involves bonding one end of a wire fed from a capillary to a first bonding surface, followed by a series of movements in various directions to ensure accurate placement. Additionally, the method includes rotating the first bonding surface to facilitate bonding with the second surface, achieving an angle of 200° or more. His second patent focuses on a wire bonding method and bump forming method that prevents wire contact with substrates after bonding, ensuring the integrity of the connections.
Career Highlights
Yasuda is currently employed at Kaijo Corporation, where he continues to develop and refine his innovative techniques. His work has been instrumental in advancing wire bonding processes, which are essential for the production of reliable electronic components.
Collaborations
Yasuda collaborates with talented coworkers, including Rei Imai and Shinobu Ishii, who contribute to the innovative environment at Kaijo Corporation. Their combined expertise fosters a culture of creativity and technical advancement.
Conclusion
Tamanari Yasuda's contributions to wire bonding technology exemplify the importance of innovation in the electronics industry. His patents reflect a commitment to improving manufacturing processes and ensuring the reliability of electronic connections.