Company Filing History:
Years Active: 1996
Title: Takuya Iida: Innovator in Copper Clad Laminate Technology
Introduction
Takuya Iida is a notable inventor based in Yuuki, Japan. He has made significant contributions to the field of printed circuit board technology. His innovative work focuses on enhancing the adhesion properties of copper clad laminates.
Latest Patents
Takuya Iida holds 1 patent for his invention related to copper clad laminates and multilayer printed circuit boards. His patent describes a copper clad laminate that ensures powerful adhesion between the copper foil and insulating layer. This is achieved without creating protrusions on the copper foil or requiring roughing treatment. The design incorporates a metal layer on the side bonded with the insulating layer, allowing for cross-linking through chemical bonds involving sulfur atoms. Additionally, his multilayer printed circuit board features alternating metal layers and insulating layers that are also cross-linked by chemical bonds through sulfur atoms, ensuring strong adhesion.
Career Highlights
Takuya Iida is associated with Nippon Denkai, Ltd., where he continues to develop innovative technologies in the field of electronics. His work has been instrumental in advancing the quality and reliability of printed circuit boards.
Collaborations
Takuya collaborates with talented individuals such as Hitoshi Yokono and Haruki Yokono, contributing to a dynamic work environment that fosters innovation.
Conclusion
Takuya Iida's contributions to copper clad laminate technology exemplify his commitment to innovation in the electronics industry. His patented work enhances the performance of printed circuit boards, showcasing the importance of strong adhesion in electronic components.