Location History:
- Kawasaki, JP (2000 - 2001)
- Utsunomiya, JP (2011)
Company Filing History:
Years Active: 2000-2011
Title: Takuya Hatao: Innovator in Semiconductor Packaging
Introduction
Takuya Hatao is a prominent inventor based in Utsunomiya, Japan. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His work focuses on enhancing the reliability and design potential of flip-chip semiconductor packages.
Latest Patents
Hatao's latest patents include a connecting structure for flip-chip semiconductor packages, build-up layer material, and sealing resin composition. The invention provides a connecting structure that inhibits or reduces cracking and delamination, thereby improving reliability. It also expands the design potential for the inner circuitry of circuit boards while reducing inductance. The structure includes a circuit board with a core layer and at least one build-up layer, a semiconductor element connected via metal bumps, and a sealing resin composition that fills gaps between the semiconductor element and the circuit board. The cured product of the sealing resin composition has a glass transition temperature between 60°C and 150°C, with a coefficient of linear expansion from room temperature to the glass transition temperature ranging from 15 ppm/°C to 35 ppm/°C. Additionally, the cured product of the build-up layer has a glass transition temperature of at least 170°C and a coefficient of linear expansion in the in-plane direction of not more than 40 ppm/°C.
Career Highlights
Hatao is currently employed at Sumitomo Bakelite Company Limited, where he continues to innovate in the semiconductor field. His work has been instrumental in advancing technologies that enhance the performance and reliability of electronic devices.
Collaborations
Hatao has collaborated with notable colleagues, including Mitsumoto Murayama and Takashi Yamaji, contributing to a dynamic and innovative work environment.
Conclusion
Takuya Hatao's contributions to semiconductor packaging technology demonstrate his commitment to innovation and reliability in electronic design. His patents reflect a deep understanding of materials and engineering principles, making him a valuable asset in the field.