Company Filing History:
Years Active: 2003
Title: Takuji Seri - Innovator in Multi-layer Wiring Substrates
Introduction
Takuji Seri is a notable inventor based in Kokubu, Japan. He has made significant contributions to the field of electronics through his innovative designs and patents. His work primarily focuses on enhancing the performance and efficiency of wiring substrates.
Latest Patents
Takuji Seri holds a patent for a multi-layer wiring substrate. The objective of this invention is to meet the demands of high-density wiring packages while ensuring soldering thermal resistance, insulating properties, and high-frequency transmission characteristics. The multi-layer wiring substrate consists of several dielectric layers, each equipped with wiring conductors made of metallic foil on at least one surface. These conductors are electrically connected through a through conductor formed within the dielectric layer. The dielectric layers are composed of a liquid crystal polymer layer and cladding layers made of a polyphenylene ether-type organic substance.
Career Highlights
Takuji Seri is associated with Kyocera Corporation, where he has been instrumental in developing advanced technologies in the electronics sector. His innovative approach has led to the creation of solutions that address complex challenges in wiring substrates.
Collaborations
Takuji has collaborated with notable colleagues, including Katsura Hayashi and Tadashi Nagasawa, to further enhance the impact of their innovations in the industry.
Conclusion
Takuji Seri's contributions to the field of multi-layer wiring substrates exemplify his commitment to innovation and excellence. His patent reflects a significant advancement in technology, showcasing his expertise and dedication to improving electronic components.