Company Filing History:
Years Active: 2004
Title: The Innovations of Takeshi Funaki
Introduction
Takeshi Funaki is a notable inventor based in Musashino, Japan. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique substrate for semiconductor packages.
Latest Patents
Takeshi Funaki holds a patent for a substrate used in the packaging of semiconductor devices. The patent describes a method for fabricating a composite metal laminate consisting of a first metal layer, a second metal layer, and a carrier layer. The first metal layer has etching characteristics that differ from those of the second metal layer when exposed to the same etchant. This allows for the selective etching of the first metal layer until the second metal layer is exposed, forming pillar-like interconnections. The gaps between these interconnections are filled with resin to create a resin base. The carrier layer is then removed, and the second metal layer is selectively etched to form a conductive pattern on the resin base. This innovative approach enhances the efficiency and reliability of semiconductor packages.
Career Highlights
Takeshi Funaki is currently employed at Hitachi Chemical Company, Ltd., where he continues to advance semiconductor technology. His work has been instrumental in improving the manufacturing processes of semiconductor devices. With a focus on innovation, he has contributed to the development of new materials and methods that enhance the performance of electronic components.
Collaborations
Throughout his career, Takeshi has collaborated with esteemed colleagues such as Yoshiaki Wakashima and Naoki Fukutomi. These collaborations have fostered a creative environment that encourages the exchange of ideas and the pursuit of groundbreaking innovations.
Conclusion
Takeshi Funaki's contributions to semiconductor technology exemplify the spirit of innovation. His patented methods and collaborative efforts continue to shape the future of electronic devices. His work not only enhances the performance of semiconductor packages but also sets a standard for future advancements in the field.