Company Filing History:
Years Active: 2008-2009
Title: Takeru Fujinaga: Innovator in Semiconductor Technology
Introduction
Takeru Fujinaga is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on improving the methods and materials used in semiconductor chip mounting.
Latest Patents
Fujinaga's latest patents include a semiconductor chip mounting substrate and a method of producing the same. This innovative chip mounting substrate is designed for bonding a semiconductor chip to a substrate. It features a solder layer that is connectable to a semiconductor chip. Notably, the solder layer comprises a layer including δ-phase crystal grains of an Au–Sn alloy at its surface. This unique composition enhances the bonding process. During the mounting of a semiconductor chip on the substrate, both the substrate and the solder layer are heated. An image of the solder layer is captured to perform an image evaluation, which helps detect the timing and position for mounting the semiconductor chip accurately.
Career Highlights
Fujinaga is currently employed at Hitachi, Ltd., where he continues to develop innovative solutions in semiconductor technology. His expertise and dedication have positioned him as a key player in his field.
Collaborations
He has collaborated with notable coworkers, including Kazuhiro Hirose and Hideaki Takemori, contributing to various projects that advance semiconductor technology.
Conclusion
Takeru Fujinaga's work in semiconductor technology exemplifies innovation and dedication. His patents reflect a commitment to enhancing the efficiency and effectiveness of semiconductor chip mounting processes.