Company Filing History:
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1 out of 832,966 Years Active: 2000-2001
Title: Takatoshi Arikawa: Innovator in Solder Materials
Introduction
Takatoshi Arikawa is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of solder materials, particularly in the development of environmentally-friendly and high-performance solder solutions. With a total of 2 patents, his work has had a considerable impact on the reliability of electronic components.
Latest Patents
Arikawa's latest patents focus on solder materials and electronic parts utilizing these innovative materials. One of his key inventions is a lead-free high-temperature solder material that comprises 0.005-3.0 wt % of palladium (Pd) and 97.0-99.995 wt % of tin (Sn). This solder material boasts a liquidus temperature ranging from 200-350°C, making it both environmentally-friendly and improved in thermal fatigue properties. The process involves mixing a predetermined amount of Sn and Pd, vacuum-melting, and casting to prepare an ingot, which is then rolled into a tape and pressed to create solder pellets.
Another significant invention is a solder material designed to enhance heat fatigue resistance when joining electronic components to substrates. This solder material contains specific percentages of iron (Fe) and nickel (Ni), along with silver (Ag) or indium (In), and is aimed at reducing damage to the nickel film interposed between components.
Career Highlights
Throughout his career, Takatoshi Arikawa has worked with various companies, including Tanaka Denki Kogyo Kabushiki Kaisha. His expertise in solder materials has positioned him as a key figure in the electronics industry, contributing to advancements that improve the performance and reliability of electronic devices.
Collaborations
Arikawa has collaborated with notable colleagues such as Toshinori Ogashiwa and Masami Yokozawa. These partnerships have further enriched his work and led to innovative solutions in the field of solder materials.
Conclusion
Takatoshi Arikawa's contributions to solder materials have significantly advanced the electronics industry. His innovative patents reflect a commitment to improving the reliability and environmental impact of electronic components.