Takashi Doi

Title: The Innovations of Takashi Doi

Introduction

Takashi Doi is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of thermal management through his innovative designs and patents. With a total of two patents to his name, Doi has focused on enhancing the efficiency of heat transfer systems.

Latest Patents

Doi's latest patents include a heat pipe and a method for processing the same. This heat pipe features a flat container with a member, such as a rod, plate, or mesh, fixedly arranged between the narrow walls of the container. This design allows for space within the inner circumference of the container in both the width and length directions. Another significant patent is for a radiator structure that includes a heat receiving member, a heat pipe, and a heat radiating member. In this radiator, the heat receiving member is designed with a heat pipe insertion groove, allowing one end of the heat pipe to be securely positioned within the member.

Career Highlights

Doi is currently employed at Diamond Electric Mfg. Co., Ltd., where he continues to innovate in the field of thermal management. His work has been instrumental in developing more efficient heat transfer solutions that are applicable in various industries.

Collaborations

Throughout his career, Doi has collaborated with talented individuals such as Akimi Shutou and Yoshio Ishida. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Takashi Doi's contributions to the field of thermal management through his patents and collaborations highlight his role as an influential inventor. His work continues to impact the industry positively, paving the way for future innovations in heat transfer technology.