Company Filing History:
Years Active: 1985-2003
Title: Takao Uematsu: Innovator in Thermal Conductive Technologies
Introduction
Takao Uematsu is a prominent inventor based in Hitachi, Japan. He has made significant contributions to the field of thermal conductive materials, holding a total of 7 patents. His work focuses on enhancing the efficiency of cooling devices through innovative grease compositions.
Latest Patents
One of Uematsu's latest patents is a highly thermal conductive grease composition and a cooling device utilizing this composition. This grease composition is designed to have both high thermal conductivity and excellent dispensing properties. It consists of 70 to 90% by volume of an inorganic powder, which is a mixture of at least two different inorganic powders with varying average particle sizes. Additionally, it contains 10 to 30% by volume of a base oil, which can be either mineral or synthetic oil, along with a surfactant in an amount ranging from 0.2 to 2.0% by weight based on the weight of the inorganic powder.
Another notable patent involves an apparatus equipped with a cooling block unit that has sliding parts. This invention includes a compound that prevents the diffusion or separation of the base oil used in electronic or electric appliances. The apparatus is designed to effectively manage heat generated by a Joule heat source, ensuring efficient heat transfer between the heat-generating source and the cooling mechanism.
Career Highlights
Uematsu is associated with Hitachi, Ltd., a leading company in technology and innovation. His work has significantly impacted the development of cooling technologies, making them more efficient and reliable.
Collaborations
Throughout his career, Uematsu has collaborated with notable colleagues, including Shigeki Komatsuzaki and Fumio Nakano. These collaborations have further enhanced the innovative capabilities within his field.
Conclusion
Takao Uematsu's contributions to thermal conductive technologies exemplify the importance of innovation in enhancing device efficiency. His patents reflect a commitment to advancing cooling solutions in electronic applications.