Location History:
- Koto-ku, JP (2006)
- Tokyo, JP (2012 - 2017)
Company Filing History:
Years Active: 2006-2017
Title: Inventor Takao Kurosawa: Innovating Packaging Solutions
Introduction
Takao Kurosawa, a prominent inventor based in Tokyo, Japan, has made significant contributions to the field of packaging through his innovative designs and techniques. With a total of three patents to his name, Kurosawa's work focuses on improving the functionality and efficiency of containers used in various industries.
Latest Patents
Among his latest inventions are the "In-mold labeled container and molding process thereof" and the "Bag container." The first patent details a method for setting a predetermined height position for the portion of parison or preform that first contacts the molding surfaces of a split mold. This design helps prevent air entrapment between in-mold labels and the blow-molded container, enhancing product quality. The second patent introduces a synthetic-resin bag container equipped with a spout-forming portion and filling inlet. This advanced design includes features such as a square cross-section sealing base and triangular panels that facilitate efficient sealing after filling.
Career Highlights
Throughout his career, Takao Kurosawa has worked with notable companies, including Yoshino Kogyosho Co., Ltd. and Kao Corporation. His experiences in these firms have allowed him to refine his skills and develop practical inventions that respond to industry needs.
Collaborations
Kurosawa has collaborated with esteemed coworkers, including Nobuo Yamanaka and Yoshio Akiyama. Together, they have contributed to advancing packaging technology, combining their expertise to create innovative solutions for contemporary challenges.
Conclusion
Takao Kurosawa's inventive spirit and dedication to improving packaging design have led him to create solutions that not only enhance user experience but also promote efficiency in manufacturing processes. His contributions will undoubtedly continue to impact the industry, inspiring future innovations in packaging technology.