Company Filing History:
1 out of 832,912 Years Active: 2004
Title: The Innovations of Takahiro Umeda: A Pioneer in Copper Polishing Technology
Introduction: Takahiro Umeda, based in Nishikasugai-gun, Japan, is an accomplished inventor with a significant contribution to the field of material processing. With one patent to his name, Umeda has developed a method that enhances the polishing process of copper layers on substrates, showcasing his innovative approach to improving manufacturing techniques.
Latest Patents: Umeda's patent, titled "Method of Polishing Copper Layer of Substrate," introduces a novel technique that is aimed at increasing the stock removal rate while polishing. The method involves several steps, starting with the placement of a substrate onto a polishing pad, where the copper layer faces the pad. The process includes applying pressure through a backing pad by a press head, rotating the press head in relation to the polishing plate, and supplying polishing slurry to the pad. Notably, the backing pad is designed with specific material properties, maintaining an Asker C hardness of 75-95 and a compressibility of 10% or less. The innovative polishing slurry incorporates a chelating agent, an etching agent, an oxidizing agent, and water, effectively optimizing the polishing process.
Career Highlights: Throughout his career, Takahiro Umeda has demonstrated a dedication to advancing technologies related to substrate processing. His innovative method not only enhances efficiency but also contributes to improving the quality of finished products in various industrial applications. The impact of his patent is expected to resonate throughout the semiconductor and electronics manufacturing sectors.
Collaborations: Umeda has collaborated with fellow innovators and colleagues, including Noriko Miyairi and Yasuo Inada. These partnerships have allowed him to refine his ideas and bring unique insights into the development of new technologies.
Conclusion: Takahiro Umeda's contributions to the field of polishing technologies are noteworthy, particularly with his patented method that enhances copper layer processing. As the industry continues to evolve, Umeda's innovative approach serves as a beacon for future advancements, pushing the boundaries of material science and manufacturing efficiency.