Tokyo, Japan

Takahiko Gomi

USPTO Granted Patents = 6 

 

Average Co-Inventor Count = 2.3

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2016-2022

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6 patents (USPTO):Explore Patents

Title: Takahiko Gomi: Innovator in Semiconductor Technology

Introduction

Takahiko Gomi is a prominent inventor based in Tokyo, Japan, known for his significant contributions to semiconductor technology. With a total of six patents to his name, Gomi has made strides in developing advanced devices that enhance performance while managing thermal efficiency.

Latest Patents

Gomi's latest patents include innovative designs for semiconductor devices and thermo-control systems. One of his notable inventions involves a CPU that incorporates multiple cores, featuring a temperature determination unit that assesses whether the temperature exceeds a specified threshold. When the temperature is deemed too high, a thermal generation control unit intervenes to manage heat generation effectively. Another patent focuses on a semiconductor device that minimizes heating by optimizing performance across various modules, utilizing a load detection unit and a heat generation control unit to regulate power consumption based on operational rates.

Career Highlights

Takahiko Gomi is currently employed at Renesas Electronics Corporation, where he continues to push the boundaries of semiconductor technology. His work has been instrumental in developing solutions that address the challenges of heat management in high-performance computing environments.

Collaborations

Gomi collaborates with talented colleagues, including Ryu Nagasawa and Tetsuya Suzuki, to drive innovation within the field. Their combined expertise fosters a creative environment that leads to groundbreaking advancements in semiconductor technology.

Conclusion

Takahiko Gomi's contributions to the field of semiconductor technology exemplify the impact of innovative thinking in addressing modern technological challenges. His patents reflect a commitment to enhancing device performance while ensuring efficient thermal management.

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