Taipei, Taiwan

Tai-Ying Tu


Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2025

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3 patents (USPTO):Explore Patents

Title: Innovations by Tai-Ying Tu in Immersion Cooling Technology

Introduction

Tai-Ying Tu is a notable inventor based in New Taipei, Taiwan. He has made significant contributions to the field of electronic device cooling systems, holding a total of three patents. His work focuses on innovative methods for heat dissipation, which are crucial for the performance and longevity of electronic devices.

Latest Patents

One of Tai-Ying Tu's latest patents is for an immersion liquid cooling equipment and heat dissipation method for electronic devices. This invention includes a tank that accommodates a first fluid, allowing the electronic device to be immersed in it. The system features a condenser located above the first fluid and a cold plate in thermal contact with high power components of the electronic device. Additionally, a first pipe connects the condenser and cold plate, facilitating the flow of a second fluid for effective heat dissipation. Another significant patent is for an immersion cooling system that comprises a work tank, chip device, microchannel device, and heat exchange components. This system is designed to enhance the cooling efficiency of electronic devices by utilizing a fluid section within the work tank.

Career Highlights

Tai-Ying Tu is currently employed at Wiwynn Corporation, where he continues to develop advanced cooling technologies. His expertise in immersion cooling systems has positioned him as a key player in the industry, contributing to the evolution of thermal management solutions for electronic devices.

Collaborations

Throughout his career, Tai-Ying Tu has collaborated with talented individuals such as Ting-Yu Pai and Chia-Yi Wu. These collaborations have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Tai-Ying Tu's contributions to immersion cooling technology demonstrate his commitment to advancing electronic device performance through innovative heat dissipation methods. His patents reflect a deep understanding of thermal management, making him a significant figure in the field.

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