Tae Koo Lee

Title: Innovator Spotlight: Tae Koo Lee

Introduction: Tae Koo Lee, an accomplished inventor based in Ansan, South Korea, has made significant contributions to the field of semiconductor technology. With two patents to his name, Lee's innovative work is primarily focused on enhancing the efficiency and effectiveness of semiconductor device packaging.

Latest Patents: Tae Koo Lee's latest patents include groundbreaking inventions that demonstrate his prowess in semiconductor technology. The first patent is for a "Vertical Semiconductor Device Package Having Printed Circuit Board and Heat Spreader." This invention presents a vertical semiconductor device package that comprises a semiconductor chip, a heat spreader, a printed circuit board (PCB), metal wires, and encapsulating material. The design improves heat dissipation properties and electrical characteristics by directly attaching the semiconductor chip to the heat spreader and/or to the metal layers of the PCB, which incorporates multiple ground metal layers. In addition, the application details a package module with several vertical semiconductor device packages, all of which are mounted on a second circuit board fitted with a heat sink.

The second patent is for an "Apparatus for Inner Lead Bonding (ILB) Comprising a Heat Dissipation Pin." This invention features an inner lead bonding apparatus equipped with a heat dissipation plate that is attached to inner leads and a support system designed to uphold the lead frame of a tape automated bonding package. The heat dissipation plate plays a crucial role during the inner lead bonding process, as it is strategically positioned near the bonding interface. Its design includes a fastener for stability and elliptical bolt holes for controlled positioning concerning the inner leads.

Career Highlights: Tae Koo Lee is currently associated with Samsung Electronics Co., Ltd., where he leverages his expertise in semiconductor technology to drive innovation and progress in the industry. His work is characterized by a commitment to advancing the reliability and performance of electronic devices through improved semiconductor packaging solutions.

Collaborations: Throughout his career, Lee has collaborated with notable professionals in the field, including colleagues Il Gyu Jung and Tae Gyeong Chung. These collaborations have further enhanced the development and implementation of innovative semiconductor technologies.

Conclusion: Tae Koo Lee's contributions to semiconductor technology reflect his dedication to innovation and excellence. His two patents not only exemplify his inventive spirit but also pave the way for advancements in electronic device performance and reliability. As an inventor, Lee continues to push the boundaries of what is possible in the world of semiconductors, inspiring future innovations in the industry.