Company Filing History:
Years Active: 2003-2006
Title: Tadao Ishikawa: Innovator in Metal-Bonded Grinding Tools
Introduction
Tadao Ishikawa is a notable inventor based in Mobara, Japan. He has made significant contributions to the field of grinding tools, particularly through his innovative designs and patents. With a total of 3 patents, Ishikawa has established himself as a key figure in the development of metal-bonded grinding technology.
Latest Patents
Ishikawa's latest patents include a metal-bonded grinding tool that features a base and abrasive grains bonded to the base using a metal bond matrix containing a copper alloy as a primary component. This innovative design incorporates a content of at least one of an alloy phase, a mixed phase, and an intermetallic compound of zirconium and titanium in the metal bond matrix, ranging from 3.8 to 19.2 wt %. Another significant patent is for a metal-bonded grinding tool and its manufacturing method, which also includes a base and abrasive grains bonded by a bond matrix containing a copper alloy. This bond matrix is enhanced with a powder selected from titanium, aluminum, or a mixture thereof, ensuring that the average grain protrusion is set to 30% or more of the average grain diameter, while the average grain spacing is set to 200% or more of the average grain diameter.
Career Highlights
Throughout his career, Tadao Ishikawa has worked with several companies, including Tenryu Seikyo Kabushiki Kaisha and Asaoka Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to advancements in grinding tool technology.
Collaborations
Ishikawa has collaborated with notable coworkers such as Sokichi Takemura and Toshihiko Asada. These partnerships have played a crucial role in his innovative endeavors and have helped to foster a collaborative environment for technological advancements.
Conclusion
Tadao Ishikawa's contributions to the field of metal-bonded grinding tools highlight his innovative spirit and dedication to advancing technology. His patents and collaborations reflect a commitment to excellence in engineering and design.