Company Filing History:
Years Active: 1987-1992
Title: Tadaaki Kume: Innovator in Packaging Technology
Introduction
Tadaaki Kume is a notable inventor based in Tokushima, Japan. He has made significant contributions to the field of packaging technology, holding a total of 5 patents. His innovative designs have improved the efficiency and functionality of packaging machines.
Latest Patents
Among his latest patents is a filling nozzle that features a vertical tubular nozzle body. This nozzle includes at least one perforated plate at its lower-end opening, which prevents liquid from flowing down under gravity due to the surface tension of the liquid. The perforated plate is designed with an opening degree that varies from small to great, transitioning from its center toward the periphery. Another significant patent is for a packaging machine that prepares sealed containers filled with contents from a blank that has a thermoplastic synthetic resin layer on each surface. This machine ensures that the container is recessed in the central portion of its bottom for stable seating. The bottom forming end portion of the blank is folded flat and pressed against a mandrel to form the container's bottom, utilizing a projection that complements the cavity defined by the mandrel.
Career Highlights
Tadaaki Kume is currently associated with Shikoku Kakoki Co., Ltd., where he continues to innovate in packaging solutions. His work has been instrumental in advancing the technology used in packaging machines, making them more efficient and user-friendly.
Collaborations
Throughout his career, Tadaaki has collaborated with talented individuals such as Yoshihiro Saijo and Yasuji Fujikawa. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies in the packaging industry.
Conclusion
Tadaaki Kume's contributions to packaging technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the industry, paving the way for future advancements in packaging solutions.