Tianjin, China

Suya Li


Average Co-Inventor Count = 15.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Suya Li: Innovator in Imaging Methods for Residual Stress

Introduction

Suya Li is a notable inventor based in Tianjin, China. He has made significant contributions to the field of imaging methods, particularly in the analysis of residual stress in basin insulators. His innovative approach has led to the development of a patented technology that enhances the understanding of material stress distribution.

Latest Patents

Suya Li holds a patent for an "Imaging method and system for residual stress of basin insulator, and method for preparing test block." This invention provides a comprehensive imaging method that includes cutting and preparing a standard industrial sample of a basin insulator. It involves testing the acoustoelastic coefficient of the sample, obtaining residual stress data, and calculating a stress distribution cloud map. The method also includes reliability verification based on the residual stress data, making it a valuable tool for material analysis.

Career Highlights

Throughout his career, Suya Li has worked with the Electric Power Science & Research Institute of State Grid Tianjin Electric Power Company and the State Grid Tianjin Electric Power Company. His experience in these organizations has allowed him to apply his innovative ideas in practical settings, contributing to advancements in electrical engineering and material science.

Collaborations

Suya Li has collaborated with notable colleagues, including Jin He and Chun He, who have contributed to his research and development efforts. Their teamwork has fostered an environment of innovation and has led to the successful implementation of various projects.

Conclusion

Suya Li's contributions to the field of imaging methods for residual stress analysis demonstrate his commitment to innovation and excellence. His patented technology not only advances material science but also enhances the reliability of engineering applications.

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