Location History:
- Kawasaki, JP (2016)
- Isehara, JP (2014 - 2017)
Company Filing History:
Years Active: 2014-2017
Title: Susumu Ogata: Innovator in Heat Pipe Technology
Introduction
Susumu Ogata is a prominent inventor based in Isehara, Japan. He has made significant contributions to the field of thermal management through his innovative designs and patents. With a total of five patents to his name, Ogata has established himself as a key figure in the development of advanced cooling technologies.
Latest Patents
Ogata's latest patents include groundbreaking inventions such as the loop heat pipe and electronic equipment utilizing this technology. The loop heat pipe features an evaporator that vaporizes a liquid-phase working fluid using heat from a heat source. It also includes a condenser to condense the vaporized working fluid and a circulation path that connects the condenser and evaporator in a loop. Additionally, the design incorporates a tank to accommodate the liquid-phase working fluid and a bypass line to discharge vapor bubbles produced during operation. Another notable patent is a cooling device that utilizes a loop type heat pipe, which includes an evaporator with a built-in wick and a unique arrangement of discharge ports and grooves to enhance fluid management and prevent wick dry-out.
Career Highlights
Ogata is currently employed at Fujitsu Corporation, where he continues to innovate and develop new technologies. His work has been instrumental in advancing the efficiency and effectiveness of cooling systems in various electronic applications.
Collaborations
Throughout his career, Ogata has collaborated with notable colleagues such as Hiroki Uchida and Seiji Hibino. These partnerships have fostered a creative environment that has led to the successful development of several patented technologies.
Conclusion
Susumu Ogata's contributions to heat pipe technology and cooling devices have made a lasting impact in the field of thermal management. His innovative spirit and dedication to research continue to drive advancements in electronic cooling solutions.