Sung-Yi Hsiao

Title: Innovations of Sung-Yi Hsiao in Conductive Substrate Technology

Introduction

Sung-Yi Hsiao is a prominent inventor based in Miaoli County, Taiwan. He has made significant contributions to the field of conductive substrate technology, holding a total of five patents. His work focuses on innovative methods for manufacturing conductive substrate structures that enhance electronic device performance.

Latest Patents

One of his latest patents is a method for manufacturing a conductive substrate structure with conductive channels formed by using a two-sided cut approach. This conductive substrate structure includes a substrate unit, a conductive pad unit, and a conductive layer unit. The substrate unit features a top surface, a bottom surface, two opposite lateral surfaces, and a front surface. The conductive pad unit consists of at least two first conductive pads separated from each other and disposed on the top surface, along with at least two second conductive pads on the bottom surface. The conductive layer unit has at least two first conductive layers formed on the front surface, which are electrically connected to the front sides of the first conductive pads. Additionally, at least two second conductive layers are formed on the opposite lateral surfaces, connecting to the second conductive pads. This innovative design allows for efficient electrical connections between the layers.

Career Highlights

Sung-Yi Hsiao is currently employed at Harvatek Corporation, where he continues to develop cutting-edge technologies in the field of conductive substrates. His expertise and innovative approach have positioned him as a key figure in his company and the industry.

Collaborations

He has collaborated with notable coworkers, including Bily Wang and Jack Chen, contributing to various projects that advance the technology of conductive substrates.

Conclusion

Sung-Yi Hsiao's work in conductive substrate technology exemplifies innovation and dedication to improving electronic device performance. His patents reflect a deep understanding of the complexities involved in manufacturing conductive structures, making him a valuable asset to Harvatek Corporation and the broader technological community.