Union City, CA, United States of America

Sumant Sood


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:

goldMedal1 out of 832,680 
Other
 patents

Years Active: 2020

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1 patent (USPTO):

Title: The Innovative Mind of Sumant Sood: Pioneering Metal-to-Metal Adhesion in Micro Devices

Introduction

Sumant Sood, based in Union City, CA, is a notable inventor in the realm of micro device technology. With a keen focus on enhancing micro device manufacturing processes, he has contributed significantly through his innovative approach to metal adhesion.

Latest Patents

Sumant Sood holds a patent for the "Micro Device Metal Joint Process," which introduces a method for creating metal-to-metal adhesion joints. This technology is crucial for adhering micro devices to carrier substrates during the manufacturing process. The patent outlines a process in which these metal joints need to be broken to remove micro devices from their carrier substrates, leading to devices with nubs that protrude from the bottom contacts. Upon integration, these micro devices can be bonded to a receiving substrate, with the nubs either embedded in a metallic joint or diffused as interstitial material within the joint.

Career Highlights

Throughout his career, Sumant Sood has demonstrated an exceptional aptitude for innovation in the field of micro technologies. His singular patent showcases not only technical expertise but also a vision for improving micro device transfer techniques in manufacturing, which could lead to advancements in various applications.

Collaborations

Sumant has worked alongside talented individuals in the industry, including his coworkers Dariusz Golda and James Michael Perkins. Their collaborative efforts have contributed to enhancing the technological landscape surrounding micro devices and adhesion methods.

Conclusion

Sumant Sood stands out as a pioneering inventor with his inventive solutions for micro device manufacturing challenges. His patent for the metal-to-metal adhesion process is a testament to his innovative spirit and dedication to advancing technology in the micro device sector. As he continues to work alongside skilled colleagues, the future of micro device technology looks promising, thanks to his contributions and insights.

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